Thermal pads and THERMALLY CONDUCTIVE GREASE SERIES

Product: Thermal pads Part No.: ES900-18G  Features and Applications: 1. Good thermal conductivity and insulation. In order to solve integrated chips’ heat dissipation, you only have to attach the chips to heating plate and then the chips’ heat dissipation effect will be the same as that of heat sinks. 2. High insulation, shock absorption, and impact resistance, wide operating humidity and temperature ranges (-40